2021-2022 Editorial Board

Editor-in-Chief

Mircea Stan
  • Mircea Stan
  • Electrical and Computer Engineering
  • University of Virginia
  • Charlottesville, Virginia 22904 USA
  • mircea@virginia.edu
  • High-performance low-power design; VLSI circuits; Processing in memory; Hardware accelerators; Nanoelectronics

Associate Editor-in-Chief

Xinfei Guo
  • Xinfei Guo
  • UM-SJTU Joint Institute
  • Shanghai Jiao Tong University
  • Shanghai 200240, China
  • xinfei.guo@sjtu.edu.cn
  • Electronic design automation; Hardware/software co-design; Reliability; Hardware acceleration; Edge intelligence

Associate Editor

Magdy Abadir
  • Magdy Abadir
  • Abadir and Associates
  • 5824 Westslope Dr, Austin, TX 78731
  • magdy.abadir@gmail.com
  • EDA; Test; Verification; Security; Electromagnetic-Coupling

Associate Editor

Mohamed Saleh Abouelyazid
  • Mohamed Saleh Abouelyazid
  • Calibre, Design To Silicon
  • Siemens EDA
  • Cairo, Egypt, 11835
  • saleh.mohamed@siemens.com
  • mohsaleh@aucegypt.edu
  • Physical Verification; Parasitic Extraction; Interconnect Modeling; Electronic Design Automation; Layout Routing

Associate Editor

Tughrul Arslan
  • Tughrul Arslan
  • Integrated Electronic Systems
  • Scottish Microelectronics Centre
  • Kings Buildings, Edinburgh, EH9 3FF
  • T.Arslan@ed.ac.uk
  • Adaptive Circuits and Systems; Reconfigurable Hardware and systems; Circuits and systems for mission critical applications; Adaptive and reconfigurable computing for High performance computing; cloud and Big data; Adaptive and Neural systems for 5G and Wireless Communications; Adaptive and reconfigurable systems for healthcare and microwave imaging; Low power systems for wireless; wearable; implantable and IoT devices; Reconfigurable systems for navigation applications

Associate Editor

Chye Chirin Boon
  • Chye Chirin Boon
  • Nanyang Technological Univ.
  • Singapore
  • ECCBoon@ntu.edu.sg
  • RF Receiver; RF Transmitter; Phase-locked Loop (PLL); Wireless IC; MMW IC

Associate Editor

Chip-Hong Chang
  • Chip-Hong Chang
  • School of Electrical and Electronic Engineering
  • Nanyang Technological University
  • Singapore
  • ECHChang@ntu.edu.sg
  • Hardware Security; AI Security; Hardware Accelerators; Physical Unclonable Functions; True Random Number Generator; Privacy Protection; Application-specific Digital Signal Processors

Associate Editor

Meng-Fan (Marvin) Chang
  • Meng-Fan (Marvin) Chang
  • Department of Electrical Engineering
  • National Tsing Hua University
  • Hsinchu, 30013, Taiwan
  • mfchang@ee.nthu.edu.tw
  • Volatile Memory circuits; Nonvolatile Memory circuits; Compute-in-memory; Memory-based circuits, Low-voltage circuits;

Associate Editor

Poki Chen
  • Poki Chen
  • Department of Electronic Engineering
  • National Taiwan University of Science and Technology
  • Taipei, Taiwan, R.O.C.
  • poki@mail.ntust.edu.tw
  • Temperature sensor; Time-to-digital converter; Digital-to-time converter; Analog-to-digital converter; Digital-to-analog converter

Associate Editor

Yong Chen
  • Yong (Nick) Chen
  • State Key Laboratory of Analog and Mixed-Signal VLSI and IME/FST-ECE
  • University of Macau
  • China
  • ychen@um.edu.mo chenyong@ieee.org
  • Analog and mixed-signal integrated circuits; RF, mm-wave and THz systems and circuits; Ultra-high-speed electrical and optical wireline systems and circuits; On-chip interconnects

Associate Editor

Paolo S. Crovetti
  • Paolo S. Crovetti
  • Dept. of Electronics and Telecommunications (DET)
  • Politecnico di Torino
  • 10129 Torino (Italy)
  • paolo.crovetti@polito.it
  • Analog and Mixed Mode Circuits and Systems; Low power/low voltage analog circuits; Voltage and current references; Digital to Analog Converters/Analog to Digital Converters; Timing circuits and clock generators

Associate Editor

Raffaele De Rose
  • Raffaele De Rose
  • Department of Computer Engineering
    Modeling, Electronics and Systems Engineering (DIMES)
  • University of Calabria
  • Rende, Italy, 87036
  • r.derose@dimes.unical.it
  • low-voltage and low-power design; CMOS analog circuits; spintronics; logic-in-memory; hardware security

Associate Editor

Anh Tuan Do
  • Anh Tuan Do
  • Institute of Microelectronics
  • Singapore 138634
  • doat@ime.a-star.edu.sg
  • Emerging memory technology; Ultra-low Power hardware accelerator for AI hardware; HW security and Cryogenic CMOS

Associate Editor

Shiro Dosho
  • Shiro Dosho
  • Lab. for Future Interdisciplinary Research of Science and Tech.(FIRST)
  • Tokyo Institute of Technology
  • Yokohama, 226-8503, Japan
  • dosho.s.aa@m.titech.ac.jp
  • ADC; PLL; Sensor; Analog; CMOS

Associate Editor

Rolf Drechsler
  • Rolf Drechsler
  • University of Bremen/DFKI
  • Germany
  • drechsler@uni-bremen.de
  • Verification; Test; Logic Synthesis; Formal Methods; BDDs

Associate Editor

Ibrahim (Abe) Elfadel
  • Ibrahim (Abe) Elfadel
  • Institute Center for Microsystems (iMicro)
  • Masdar Institute of Science and Technology
  • Abu Dhabi, UAE
  • ielfadel@masdar.ac.ae
  • CAD; SoC; 3D integration; Embedded signal processing; Sensory systems

Associate Editor

Magdy A. El-Moursy
  • Magdy A. El-Moursy
  • Low Power Architect
  • Siemens EDA
  • 8105 Boeckman Rd, Wilsonville, OR 97070, USA
  • magdyaelmoursy@gmail.com
  • magdy.el-moursy@siemens.com
  • Embedded Systems; VLSI/SoC/NoC design and validation/verification; digital design flow; design automation; circuit verification and testing; physical design; interconnect design; CMOS digital electronics; digital ASIC circuit design; and related design methodologies of high performance integrated circuits (ICs)

Associate Editor

Xuanyao Fong
  • Xuanyao (Kelvin) Fong
  • Department of Electrical & Computer Engineering
  • the National University of Singapore
  • Singapore 117583
  • kelvin.xy.fong@nus.edu.sg
  • System-Technology co-design; domain-specific computing; nonvolatile device technologies; spintronics

Associate Editor

Maged Ghoneima
  • Maged Ghoneima
  • Ministry of Higher Education & Scientific Research
  • Lotus District, 5th Settlement, New Cairo
  • Cairo, Egypt
  • Mghoneima@mohesr.gov.eg
  • High-performance low-power design; VLSI circuits; Processing in memory; Hardware accelerators; On-chip interconnect and memory structures

Associate Editor

Masanori Hashimoto
  • Masanori Hashimoto
  • Department of Informatics
  • Kyoto University
  • Kyoto, Japan
  • hashimoto@i.kyoto-u.ac.jp
  • Design for reliability; Radiation effect on semiconductors; Timing analysis; Power integrity analysis; Low voltage design; Low power design

Associate Editor

Deukhyoun Heo
  • Deukhyoun Heo
  • School of Electrical Engineering and Computer Science
  • Washington State Univ. Pullman
  • WA 99164-2752 USA
  • dheo@wsu.edu
  • RF/Microwave/Mm-wave Wireless Transceiver; Power management Circuits; Wireless links for intra- and inter-chip communications; Beamforming Circuits; High Performance Interconnects for 3D ICs

Associate Editor

Tsung-Yi Ho
  • Tsung-Yi Ho
  • Dept. of Computer Science and Engineering
  • The Chinese University of Hong Kong
  • Shatin, Hong Kong
  • tyho@cse.cuhk.edu.hk
  • Biological System; CAD; Lab-on-Chips; Hardware Security; Machine Learning

Associate Editor

Yuh-Shyan Hwang
  • Yuh-Shyan Hwang
  • Department of Electronic Engineering
  • National Taipei University of Technology
  • Taipei 106, Taiwan
  • yshwang@mail.ntut.edu.tw
  • Analog ICs; Mixed-signal ICs; Power Management ICs; Sensor Circuits; Low-voltage Low-power VLSI circuits

Associate Editor

Dongsuk Jeon
  • Dongsuk Jeon
  • Graduate School of Convergence Science and Technology
  • Seoul National University
  • Seoul, South Korea 08826
  • djeon1@snu.ac.kr
  • Machine Learning; Neuromorphic Computing; Hardware Accelerators; Low-Power Digital Circuits; Power Management Circuits

Associate Editor

Ajay Joshi
  • Ajay Joshi
  • Department of ECE
  • Boston University
  • Boston MA 02215 USA
  • joshi@bu.edu
  • Security and Privacy; Silicon-photonics; Accelerators; Cross-layer optimization

Associate Editor

Tanay Karnik
  • Tanay Karnik
  • Intel Labs
  • Intel Corporation
  • Hillsboro, OR 97124
  • Tanay.Karnik@intel.com
  • Adaptive circuits; Switching converters; Cache memories; Radiation Hardening; Small Form Factor Systems

Associate Editor

Mehran Mozaffari Kermani
  • Mehran Mozaffari Kermani
  • College of Engineering
  • University of South Florida
  • Tampa, FL 33620
  • mehran2@usf.edu
  • Cryptographic Engineering; Hardware Security; Post-Quantum Cryptography; FPGA/ASIC Reliability; Testing; Fault Detection; Computer Arithmetic

Associate Editor

Chulwoo Kim
  • Chulwoo Kim
  • Dept. of Electronics Engineering
  • Korea University
  • ckim@korea.ac.kr
  • PLL; Power management; Data converter; Wireline transceiver; Energy harvesting

Associate Editor

Tony Kim
  • Tony Tae-Hyoung Kim
  • School of Electrical and Electronic Engineering
  • Nanyang Technological University
  • Singapore 639798
  • thkim@ntu.edu.sg
  • Computing-in-memory; SRAM; Emerging Memory Circuits; Ultra-Low Power Digital Circuits; Circuit Reliability

Associate Editor

Seokbum Ko
  • Seokbum Ko
  • Department of Electrical and Computer Engineering
  • University of Saskatchewan
  • Saskatoon, Canada, S7N 5A9
  • seokbum.ko@usask.ca
  • Computer arithmetic; Deep learning; Artificial Intelligence; computer architecture; biomedical engineering

Associate Editor

Jaydeep Kulkarni
  • Jaydeep Kulkarni
  • Department of Electrical and Computer Engineering
  • University of Texas at Austin
  • Austin, TX 78701
  • jaydeep@austin.utexas.edu
  • Memory; Low-voltage design; Energy-efficiency; Resiliency; Power-management

Associate Editor

Volkan Kursun
  • Volkan Kursun
  • Department of Electrical and Electronics Engineering
  • Bilkent University
  • Ankara, Turkey 06800
  • volkan.kursun@bilkent.edu.tr
  • Energy-efficient computing; Internet of intelligent things; Emerging integrated circuit technologies; Heterogeneous 3D systems-on-chip; Neuromorphic engineering

Associate Editor

Yingjie Lao
  • Yingjie Lao
  • Electrical and Computer Engineering
  • Clemson University
  • Clemson, South Carolina 29634
  • jylao@clemson.edu

Associate Editor

Yoonmyung Lee
  • Yoonmyung Lee
  • Department of Electrical and Computer Engineering
  • Sungkyunkwan University (SKKU)
  • Suwon-si, Gyeonggi-do,16419
  • South Korea
  • yoonmyung@skku.edu
  • Ultra-low power circuit design; Physically uncloneable function; SRAM; Adaptive/variation-tolerant circuit; Subthreshold circuit

Associate Editor

Huawei Li
  • Huawei Li
  • Institute of Computing Technology
  • Chinese Academy of Sciences
  • Beijing 100190, China
  • lihuawei@ict.ac.cn
  • Testing of VLSI/SOC circuits; Design verification of digital systems; Design for reliability; Error tolerant computing; Approximate computing

Associate Editor

Xing Li
  • Xing Li
  • Department of Integrated Circuits
  • Nanjing University of Aeronautics and Astronautics
  • Nanjing, Jiangsu, P. R. China
  • xingli@nuaa.edu.cn
  • Power management circuit; wireless charging; energy harvesting; DC-DC converter

Associate Editor

Xueqing Li
  • Xueqing Li
  • Department of Electronic Engineering
  • Tsinghua University
  • Beijing 100084, China
  • xueqingli@tsinghua.edu.cn
  • Data converters; Non-volatile memory; Compute-in-Memory; Emerging technologies

Associate Editor

Longyang Lin
  • Longyang Lin
  • School of Microelectronics
  • Southern University of Science and Technology
  • Shenzhen 518055, China
  • linlongyang@ieee.org
  • Digital Integrated Circuits and Systems; Ultra-Low Power VLSI Circuits; Self-Powered Sensor Nodes; Widely Energy-Scalable Systems; Compute-in-Memory

Associate Editor

Antonio Miele
  • Antonio Miele
  • Department of Electronics, Information and Bioengineering
  • Politecnico di Milano
  • Milan, Italy, 20133
  • Reliability and fault tolerance; Heterogeneous systems; Adaptive computing systems; Runtime resource management; System-level design

Associate Editor

Baker Mohammad
  • Baker Mohammad
  • Electrical and Computer Engineering Department
  • Khalifa University, Abu Dhabi
  • United Arab Emirate
  • baker.mohammad@ku.ac.ae
  • In memory computing; Low Power Digital Design; RRAM; Embedded Memory Design; System on Chip; Power management

Associate Editor

Makoto Nagata
  • Makoto Nagata
  • Graduate School of System Informatics
  • Kobe University
  • Kobe, Japan
  • nagata@cs.kobe-u.ac.jp
  • Mixed signal VLSI design; Hardware security; 3D IC; Power supply integrity; Electromagnetic compatibility

Associate Editor

Koji Nii
  • Koji Nii
  • TSMC Design Technology Japan, Inc.
  • Yokohama 220-0012, Japan
  • nii.koji@gmail.com
  • SRAM; TCAM; ROM; Low-power; Embedded memory

Associate Editor

Mahdi Nikdast
  • Mahdi Nikdast
  • Department of Electrical and Computer Engineering
  • Colorado State University
  • Fort Collins, CO 80523 USA
  • Mahdi.Nikdast@colostate.edu
  • Silicon Photonics; High-Performance Computing; Electronic-Photonic System-on-Chip; Cross-Layer Design and Optimization; Interconnects

Associate Editor

Partha Pande
  • Partha Pande
  • Computer Engineering School of EECS
  • Washington State Univ.
  • Pullman, WA 99164-2752 USA
  • pande@eecs.wsu.edu
  • Network-on-Chip; Multicore; Power Management; 3D Integration; Hardware Accelerato

Associate Editor

Bipul C. Paul
  • Bipul C. Paul
  • GLOBALFOUNDRIES
  • Malta, NY 12020, USA
  • bipul.paul@globalfoundries.com
  • Low-power digital circuits; Memory; Emerging technologies; Statistical design; Design for reliability

Associate Editor

Vailis Pavlidis
  • Vailis Pavlidis
  • Department of Computer Science
  • The University of Manchester
  • Manchester, Lancashire, M139PL, UK
  • vasileios.pavlidis@manchester.ac.uk
  • 3-D integration; Interconnect modeling; Clock distribution networks; Power integrity; Thermal analysis

Associate Editor

José Pineda de Gyvez
  • José Pineda de Gyvez
  • NXP Semiconductors
  • The Netherlands
  • jose.pineda.de.gyvez@nxp.com
  • Systems power management; Technology-aware physical design; Low power digital design; IoT edge computing; Variability tolerance

Associate Editor

Bhupendra Singh Reniwal
  • Bhupendra Singh Reniwal
  • Department of Electrical Engineering
  • Indian Institute of Technology
  • Jodhpur, India 342030
  • bhupendrar@iitj.ac.in
  • AI, Hardware Accelerators and IMC Circuits & Architectures Design, Variation/Radiation Aware Preferential Design of Embedded Memory, CFIO, GPIO Design, IBIS Model

Associate Editor

Khaled N Salama
  • Khaled N Salama
  • Electrical and Computer Engineering
  • King Abdullah University of Science and Technology (KAUST)
  • Thuwal, Saudi Arabia, 23955-6900
  • khaled.salama@kaust.edu.sa
  • Brain inspired computing; Biosensors; Biomedical circuits and systems; Emerging Technologies; mixed-signal circuits and systems

Associate Editor

Ioannis Savidis
  • Ioannis Savidis
  • Department of Electrical and Computer Engineering
  • Drexel University
  • Philadelphia, PA 19104
  • isavidis@coe.drexel.edu
  • VLSI; Hardware security; Heterogeneous 3-D integrated circuits; Low-power circuits; Clock and power delivery; ML/AI enabled EDA-CAD

Associate Editor

Patrick Schaumont
  • Patrick Schaumont
  • Department of Electrical and Computer Engineering
  • Worcester Polytechnic Institute
  • Worcester, MA 01609
  • pschaumont@wpi.edu
  • Hardware Security; Cryptographic Engineering; Side-channel Analysis; System-on-Chip; Embedded Systems

Associate Editor

Catherine Schuman
  • Catherine Schuman
  • Department of Electrical Engineering and Computer Science
  • University of Tennessee
  • Knoxville, TN 37996
  • cschuman@utk.edu
  • Neuromorphic Computing; Hardware-Software Co-Design

Associate Editor

Fabio Sebastiano
  • Fabio Sebastiano
  • Department of Quantum and Computer Engineering & Department of Microelectronics
  • Delft University of Technology
  • The Netherlands
  • F.Sebastiano@tudelft.nl
  • Cryogenic electronics; Quantum computing; Analog circuits; Mixed-signal circuits; Frequency references

Associate Editor

Anirban Sengupta
  • Anirban Sengupta
  • Discipline of Computer Science and Engineering
  • Indian Institute of Technology (IIT)
  • Indore, MP, 453552, India
  • asengupt@iiti.ac.in
  • Hardware Security; IP core Protection; High Level Synthesis; Hardware Optimization; EDA-CAD

Associate Editor

Vaishnav Srinivas
  • Vaishnav Srinivas
  • Qualcomm Inc.
  • San Diego, CA 92121
  • vaishnav.srinivas@gmail.com
  • IO circuit design; signal and power integrity; PDN design; circuits-to-systems; interconnect cross-layer exploration; heterogeneous integration

Associate Editor

Armin Tajalli
  • Armin Tajalli
  • Electrical & Computer Engineering Department
  • University of Utah
  • Salt Lake City, UT 84112
  • armin.tajalli@utah.edu
  • Data movement; High bandwidth communications; Clocking and phase-locked loops; Ultra-low-power; Analog and mixed-signal; Bio-interface circuits; Data converters

Associate Editor

Aida Todri-Sanial
  • Aida Todri-Sanial
  • Department of Electrical Engineering
  • Eindhoven University of Technology
  • 5600 MB Eindhoven, Netherlands
  • 5600 MB Eindhoven
  • Physical design; Power/clock network design; Power/thermal analysis; 3D integration; Carbon nanotubes; 2D materials, neuromorphic computing, quantum computing

Associate Editor

Valerio Vignoli
  • Valerio Vignoli
  • Department of Information Engineering and Mathematics
  • University of Siena
  • Italy
  • Valerio.vignoli@unisi.it
  • Circuits based on non-linear dynamical systems; True-random number generators (TRNGs); Pseudo-random number generators (PRNGs); Physically Unclonable Functions (PUFs); Sensor-based measurement systems

Associate Editor

Jiafeng Harvest Xie
  • Jiafeng Harvest Xie
  • Department of Electrical and Computer Engineering
  • Villanova University
  • Villanova, PA 19085 USA
  • jiafeng.xie@villanova.edu
  • Cryptographic Circuits and Accelerators; Post-Quantum Cryptographic Engineering; Hardware Security; Computer Arithmetic; VLSI Neural Network Systems Design

Associate Editor

Jiawei Xu
  • Jiawei Xu
  • State Key Laboratory of Integrated Chips and Systems
  • Fudan University
  • Shanghai, 201203 China
  • jwxu@fudan.edu.cn
  • Amplifiers; Biomedical circuits; Sensor interfaces

Associate Editor

Aibin Yan
  • Aibin Yan
  • School of Microelectronics
  • Hefei University of Technology
  • Hefei, Anhui 230601, China
  • abyan@mail.ustc.edu.cn
  • Radiation Hardening for Fault Tolerance; Soft Error Rate and Aging Analysis; Non-Volatile RAM Memory; Circuit Testing and Through-Silicon Via; Machine Learning

Associate Editor

Kaiyuan Yang
  • Kaiyuan Yang
  • Department of Electrical and Computer Engineering
  • Rice University
  • Houston, TX 77005 USA
  • kyang@rice.edu
  • Ultra-low power digital and analog circuits; Hardware security and trust; In-memory Computation; Energy harvester and power transfer; Biomedical Electronics

Associate Editor

Jun Zhou
  • Jun Zhou
  • School of Information and Communication Engineering
  • University of Electronic Science and Technology of China
  • Chengdu, Sichuan, P. R. China
  • zhouj@uestc.edu.cn
  • Machine Learning Processors; Low Power Digital ICs

Associate Editor

Mark Zwolinski
  • Mark Zwolinski
  • School of Electronics and Computer Science
  • University of Southampton
  • Southampton, SO17 1BJ, United Kingdom
  • mz1@soton.ac.uk
  • Reliability; Hardware Security; Testing; Simulation; Modeling

Editorial Assistant

Stacey Weber Jackson
  • Stacey Weber Jackson
  • School of Public and International Affairs
  • Princeton University
  • Princeton, NJ 08544
  • tvlsiadm@ieee.org